HDI laser blind buried via board

Product Image

Product Details

Layer: 8L
Base Material: FR4 TG150
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG+OSP+Impedance Control
Unit Size(mm): 65.0*50.0
Panel Size(mm): 140.0*150.0
Min W/S(mil): 3/3
Min Hole Size: 0.1mm
Solder Mask: Black
4 groups of single wire impedance and 4 groups of differential impedance
This board is a 2nd order HDI laser blind buried via board
BGA area surface treatment is OSP

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What kind of board can you offer? How about the layer count and base material?
HoYoGo can offer board of HDI, gold finger, hard gold, flexible, flex-rigid, metal base, quick-turn around and PCBA. The layer is normally from 1 to 28layer. The base material also depends on the requirement, it can be KB or shengyi, etc.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com