HYG306RF03035A
Product Image
Product Details
Rigid-Flex PCB
Layer: 3L
Base Material: FR4 TG150+PI
Board Thickness: 1.0mm
Surface Finished: ENIG
Unit Size(mm): 55.78*45.0
Panel Size(mm): 114.0*70.0
Solder Mask: Green+Yellow
Min W/S(mil): 3.94/4.9
Min Hole Size: 0.1mm Production Process
ISO Certification
UL Certification
Application areas
Who will be our parters
FAQ
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What kind of board can you offer? How about the layer count and base material?
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HoYoGo can offer board of HDI, gold finger, hard gold, flexible, flex-rigid, metal base, quick-turn around and PCBA. The layer is normally from 1 to 28layer. The base material also depends on the requirement, it can be KB or shengyi, etc.
Contact us
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.