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Products

HYG002R06004A

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HYG002R06004A
HYG002R06004A
Production process

Specification
Code HYG002R06004A Customer PN


Layer 6 Blind/Buried Via NO

Base Material FR4  Unit Size(mm) 178.3000 X 198.4000
Board thickness 1.6mm Panle Size(mm) /
X /
Min hole 0.2mm Pcs/Panle 1 X 1
Total Holes / Copper OZ(finish) 1OZ Base Cu /
W/S(mil) 3/3mil Min Hole Copper Thickness 20um

Outline Finish CNC Finish thickness tolerance +/-10%

Contour tolerance +/-0.13mm Surface Finishing
OSP

X-out / Solder Mask blue

Special request
Silkscreen White

ISO Certification

UL Certification

Application areas

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Contact us

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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