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HYG892R04121A

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HYG892R04121A
Product Details


Production process

Specification
Code HYG892R04121A Customer PN ASM PC

Layer 4 Blind/Buried Via NO

Base Material FR4 Unit Size(mm) 192.0000 X 135.0000
Board thickness 1.5MM Panle Size(mm) / X /
Min hole 0.30MM Pcs/Panle 1 X 1
Total Holes 623 Copper OZ(finish) 35um Base Cu /
W/S(mil) 8/8 Min Hole Copper Thickness 20um

Outline Finish CNC Finish thickness tolerance +/-10%

Contour tolerance +/-0.15MM Customer' Specifications Customer

X-out / Solder Mask ENIG 2u"mi
Special request / Silkscreen White

ISO Certification

UL Certification

Application areas

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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