Code | HYG892R04121A | Customer PN | ASM PC |
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Layer | 4 | Blind/Buried Via | NO |
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Base Material | FR4 | Unit Size(mm) | 192.0000 | X | 135.0000 |
Board thickness | 1.5MM | Panle Size(mm) | / | X | / |
Min hole | 0.30MM | Pcs/Panle | 1 | X | 1 |
Total Holes | 623 | Copper OZ(finish) | 35um | Base Cu | / |
W/S(mil) | 8/8 | Min Hole Copper Thickness | 20um |
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Outline Finish | CNC | Finish thickness tolerance | +/-10% |
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Contour tolerance | +/-0.15MM | Customer' Specifications | Customer |
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X-out | / | Solder Mask | ENIG | 2u"mi |
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Special request | / | Silkscreen |
White |
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.