3-step HDI PCB | HYG603R12006A

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Product Details

Special Request:
1. 3-step HDI PCB.
2. The blind vias are located between layers L1-12, L2-L3, L3-L4,
L9-L10, L10-L11, and L11-L12, as well as L9-L12. They are
laser-drilledand require copper filling and capping.
3. Impedance Control.
4. BGA Ball PAD: 0.3mm, BGA Elliptical PAD: 0.25mm.

Layer: 12L
Base Material: FR4 TG170℃
Board Thickness: 1.143mm
Outer Layer Final Copper Thickness: 1OZ
Inner Layer Final Copper Thickness: 0.5OZ&1OZ
Surface Finished: ENIG
Unit Size(mm): 91.60*201.40
Min. W/S(mil): 2.95/2.99
Min. Hole Size: 0.125mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s your quality standard? What’s certificates do you have?
Our production is strictly following high quality system of automotive products, we certified with ISO9001, ISO14001, ISO13485 and IATF16949 and C-UL-S. All products strictly follow acceptance standard IPC-A-600-H and IPC-6012.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com