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6L High Density Interconnector PCB

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6L High Density Interconnector PCB

Product Details

High density PCB
Special Request: Blind buried via
Layer: 6L
Base Material: FR4 TG170
Board Thickness: 1.54mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG+Impedance control
Unit Size(mm): 90.0*50.0
Panel Size(mm): 195.0*102.0
Min W/S(mil): 3.4/5.37
Min Hole Size: 0.15mm

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Do you have UL certificate, do you have Canada UL?
Yes, we do have UL certificate and Canada UL.

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.

(+86)-755-2300-1582

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