Changes in technology and market trend of PCB

As an important electronic connector, PCB used in almost all electronic products, is regarded as "the mother of electronic systems products, technology change and market trend has become many industry focus.

Electronic products currently has two obvious trends, one is lightweight, high speed and high frequency is two, the corresponding area of the downstream PCB to high density, high integration, encapsulation, miniaturization and multi direction, on top plate and HDI demand rising.

The top plate wiring length is short, low impedance circuit, high frequency high speed, stable performance, can undertake more complex functions, electronic technology to high speed and high frequency, the inevitable trend of multi function large capacity development. Especially the in-depth application of large-scale integrated circuits, will further drive the PCB towards high precision, high.

The 8 layer below PCB are mainly used in household appliances, PC, desktop and other electronic products, and the high performance multi server, aerospace and other high-end applications require the PCB layer in the 10 layer above. On the server as an example, in the single channel, dual server PCB in general in the 4-8 layers, and 4 road 8, road and other high-end server motherboard requires more than 16 layers, backplane requirements in more than 20 layers.

HDI wiring density relatively ordinary multi layer board has obvious advantages, has become the mainstream of the intelligent mobile phone motherboard. Intelligent mobile phone function of increasingly complex and to volume and lightweight development, more and more space for the motherboard, bearing more limited components on the motherboard, the ordinary laminate has been difficult to meet the demand.

High density interconnection circuit board (HDI) by legal laminated board, ordinary plywood for the core plate superposition layer by borehole, and the hole metallization process, realize the link between the function of internal layers. Compared with ordinary multi-storey line plate through hole, HDI set the exact blind hole and buried hole to reduce the number of vias, PCB can save wiring area, greatly improve the density of components, thus in intelligent mobile phone rapid completion of the replacement of the laminate.

The technical differences between the HDI reflected in the increasing order of layer by layer, the greater the number, the greater the technical difficulty of.HDI according to the order can be divided into first order HDI, two order HDI, higher order HDI, the number of layers is expressed as C+N+C, where N is the common core plate layer, C layer increased for HDI times. Order. High order HDI wiring density is higher, but at the same time pressing number, existence of counterpoint, punch and copper etc, technology and process capability of the manufacturers have higher requirements.

Any layer HDI is popular in recent years in high-end smartphones for the high order HDI, are blind connection between any adjacent layers, can save nearly half of the volume based on ordinary HDI, so as to make more space for the battery and other components.

Any layer HDI need to use laser drilling hole plug, electroplating and other advanced technology, the most difficult is the production of value-added products, the highest HDI type, can best embody the technical level of HDI. The current due to technical and financial barriers thicker, production capacity mainly concentrated in Japan and South Korea, Taiwan and Austria AT&S manufacturers hands