BGA PCB

Product Image

Product Details

Special Request: BGA
Layer: 8L
Base Material: FR4
Board Thickness: 1.68mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 220.0*100.0
Panel Size(mm): 240.0*120.0
Min W/S(mil): 3.9/3.9
Min Hole Size: 0.15mm
Solder Mask: Green Matt

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Can you provide some special material, like Rogers DuPont?
Yes. We can offer Rogers material, the specific type shall to be confirmed.
We can also offer Dupont material, we cooperate with Agent China.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com