Blind Via PCB | HYG1005R10004A

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Product Details

Special Request:
1. The finished 0.4mm hole is a press fit hole, with a hole tolerance: ±0.05mm,
and copper plating in the hole: 25-50um.
2. Impedance requirements.
3. The 0.2mm via requires resin plug and electroplated fill,
in accordance with IPC 4761 VII.
4. Blind vias in layers L1-L3 & L10-L8 require resin plug and electroplated fill,
in accordance with IPC 4761 VII.

Layer: 10L
Base Material: FR4 TG180℃
Board Thickness: 1.8mm
Outer Layer Final Copper Thickness: 42UM
Inner Layer Final Copper Thickness: 0.5OZ&1OZ
Base Copper Thickness: 0.5OZ
Surface Finished: ENIG
Unit Size(mm): 170.00*270.00
Min. W/S(mil): 3.937/3.56
Min. Hole Size: 0.2mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s your most advantage of your supply?
@Standard mass production (>50sqm) from 1~8layer can be with very good price.
@ Mass production (>50sqm) of CEM-1, Alu material can be with very good price.
@ Special: we can produce long board up to 550x1500mm, thin board of min 0.15mm.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com