Blind Via PCB | HYG1005R10006A

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Product Details

Special Request:
1. Blind Vias: L1-L3 and L10-L18, to be resin plugged and electroplated filled,
compliant with IPC-4761 VII.
2. 0.2mm vias: Resin plug and electroplated fill, compliant with IPC-4761 VII.
3. Impedance requirements.
4. The finished 0.4mm, 0.5mm, 0.6mm holes are press fit holes, with hole tolerance: ±0.05mm,
and copper plating thickness in the hole: 25-50um.

Layer: 10L
Base Material: FR4 TG180℃
Board Thickness: 1.8mm
Outer Layer Final Copper Thickness: 42UM
Inner Layer Final Copper Thickness: 0.5OZ&1OZ
Base Copper Thickness: 0.5OZ
Surface Finished: ENIG
Unit Size(mm): 117.00*141.50
Min. W/S(mil): 3.94/4.27
Min. Hole Size: 0.2mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Are you a manufacturer (Factory) or trading company?
HoYoGo is a manufacturer with a mass production of 500000 sqm factory and a medium-size production for small-medium volume. Our UL No. is E493066.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com