Blind Via PCB | HYG1005R10007A

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Product Details

Special Request:
1. The finished 0.4mm hole is a press fit hole, with a hole tolerance: ±0.05mm,
and copper plating in the hole: 25-50um.
2. Impedance requirements.
3. The 0.2mm via requires resin plug and electroplated fill,
in accordance with IPC 4761 VII.
4. Blind vias in layers L1-L3 & L10-L8 require resin plug and electroplated fill,
in accordance with IPC 4761 VII.

Layer: 10L
Base Material: FR4 TG180℃
Board Thickness: 1.8mm
Outer Layer Final Copper Thickness: 42UM
Inner Layer Final Copper Thickness: 0.5OZ&1OZ
Base Copper Thickness: 0.5OZ
Surface Finished: ENIG
Unit Size(mm): 170.00*270.00
Min. W/S(mil): 3.937/3.56
Min. Hole Size: 0.2mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s your quality standard? What’s certificates do you have?
Our production is strictly following high quality system of automotive products, we certified with ISO9001, ISO14001, ISO13485 and TS16949 and C-UL-S. All products strictly follow acceptance standard IPC-A-600-H and IPC-6012.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com