Blind-buried Via Board

Product Image

Product Details

Blind-buried Via Board
Layer: 4L
Base Material: FR4
Board Thickness: 1.6mm
Surface Finished: ENIG
Unit Size(mm): 89.0*112.3
Panel Size(mm): 180.0*128.3
V-CUT Angle: 30 Degrees
Remaining Thickness: 0.4 +/- 0.1mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Can you offer the third-party service, to make shipment direct to end customer but without documents (invoice)?
Yes, from our carrier partners, DHL, UPS, FEDEX, we have signed this service. And our forwarder by air or sea shipment can support this too.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com