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Civil Aviation PCB | HYG1005R04009B

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Civil Aviation PCB | HYG1005R04009B

Product Details

Special Request:
1. Civil Aviation PCB;
2. 0.2mm Vias: Resin plugged and electroplated filled, compliant with IPC-4761 VII;
3. Blind Vias(L1-L2): Resin plugged and electroplated filled, compliant with IPC-4761 VII.

Layer: 4L
Base Material: FR4 TG150℃
Board Thickness: 0.8±0.12mm
Outer Layer Final Copper Thickness: 1OZ
Inner Layer Final Copper Thickness: 3OZ
Base Copper Thickness: 0.5OZ
Surface Finished: ENIG
Unit Size(mm): 75.90*12.80
Min. W/S(mil): 7.87/5.9
Min. Hole Size: 0.2mm
Solder Mask: White

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Can you update a WIP to us every day?
Yes, no problem. We can update it to you every day or every couple of days depends on customer request.

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

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Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.

(+86)-755-2300-1582

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