Civil Aviation PCB | HYG1005R04010A

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Product Details

Special Request:
1. Civil Aviation PCB;
2. 0.2mm Vias: Resin plugged and electroplated filled, compliant with IPC-4761 VII;
3. Blind Vias(L1-L2): Resin plugged and electroplated filled, compliant with IPC-4761 VII.

Layer: 4L
Base Material: FR4 TG150℃
Board Thickness: 0.8±0.12mm
Outer Layer Final Copper Thickness: 1OZ
Inner Layer Final Copper Thickness: 3OZ
Base Copper Thickness: 0.5OZ
Surface Finished: ENIG
Unit Size(mm): 12.80*101.30
Min. W/S(mil): 6.89/5.9
Min. Hole Size: 0.2mm
Solder Mask: White

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s kind of PCB can you produce?
Our production is producing rigid PCB from 2~56layer with small- medium- mass volume. In the meantime, we can offer you FPC, Rigid-flex, HDI, all other special PCBs from our partner production.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com