Gold Finger PCB | HYG1027R02002A

Product Image

Product Details

Special Request:
1. Gold Finger(Au: Min. 0.8um, Ni: Min. 2.5um)
2. Beveling

Layer: 2L
Base Material: FR4 TG170
Board Thickness: 1.6mm
Final Copper Thickness: 2OZ
Surface Finished: ENIG+Gold finger
Unit Size(mm): 36.40*39.20

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Can you produce board of gold finger?
Yes. HoYoGo can offer you gold finger, Au thickness can be suggested standard 30u” or per customer request.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com