HYG023F02018A
Product Image
Product Details
Special Request: PI Stiffener + 1 FP4 (0.9mm) Stiffener
Layer: 2L
Base Material: PI
Board Thickness: 0.2mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 18.10*26.75
Min W/S(mil): 5.91/7.87
Solder Mask: Black Solder Mask+Yellow Coverlay
ISO Certification
UL Certification
Application areas
Who will be our parters
FAQ
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What’s your quality standard? What’s certificates do you have?
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Our production is strictly following high quality system of automotive products, we certified with ISO9001, ISO14001, ISO13485 and TS16949 and C-UL-S. All products strictly follow acceptance standard IPC-A-600-H and IPC-6012.
Contact us
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.