HYG023R04015A

Product Image

Product Details

Special Request:
1. Impedance control.
2. Plated Through Hole Copper Wall Thickness: Min. 20um, Average: 25um.
3. Solder Mask Thickness on Copper Edge: Min. 5um,
Solder Mask Thickness on Copper Surface: Min. 10um.

Layer: 4L
Base Material: FR4 TG≥170
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 47.60*47.60
Min. W/S(mil): 5/4.26
Min. Hole Size: 0.2mm
Solder Mask: Matte Black

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Are you a manufacturer (Factory) or trading company?
HoYoGo is a manufacturer with a mass production of 500000 sqm factory and a medium-size production for small-medium volume. Our UL No. is E493066.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com