HYG023R04017A

Product Image

Product Details

Special Request:
1. Impedance Control;
2. Plated Through Hole Copper Wall Thickness: Min. 20um,
Average Min. 25um;
3. Solder Mask Thickness on Copper Edge: Min. 5um;
4. Solder Mask Thickness on Copper Surface: Min. 10um.

Layer: 4L
Base Material: FR4 TG≥170 TD≥340(S1000-2M)
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 25.80*35.80
Min W/S(mil): 5.9/4.27

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s kind of PCB can you produce?
Our production is producing rigid PCB from 2~56layer with small- medium- mass volume. In the meantime, we can offer you FPC, Rigid-flex, HDI, all other special PCBs from our partner production.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com