HYG088R02024A

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Product Details

Special Request: Solder Mask Thickness: Min. 10um
Layer: 2L
Base Material: FR4 TU768
Board Thickness: 1.0mm
Final Copper Thickness: 1OZ
Surface Finished: Immersion Tin+Edge plating
Unit Size(mm): 29.00*32.90
Min. Hole Size: 0.3mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s your most advantage of your supply?
@Standard mass production (>50sqm) from 1~8layer can be with very good price.
@ Mass production (>50sqm) of CEM-1, Alu material can be with very good price.
@ Special: we can produce long board up to 550x1500mm, thin board of min 0.15mm.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com