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HYG089F01368A

Product Image

HYG089F01368A

Product Details

Flexible PCB
Layer: 1L
Base Material: PI(50UM)
Board Thickness: FPC Area: 0.12+/-0.03mm;
FPC+FR4 Stiffener Area: 1.74+/-0.174mm
Final Copper Thickness: 24.9um
Base Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 428.00*178.00
Solder Mask: Yellow coverlay

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Is there UL certificate for your flexible board?
YES. We can offer UL certificate of FPC.

Contact us

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.

(+86)-755-2300-1582

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