HYG089FR04362A

Product Image

Product Details

Rigid-flex PCB
Layer: 4L
Base Material: FR4 TG150+PI, Lowflow PP
(Low Halogen content, TG≥150℃, TD≥325℃,
CTI≥175V, CTE z-axis≤60ppm/℃ at Alpha 1 step)
Board Thickness: Rigid: 1.4mm+/-10%;
Flex: 0.2+/-0.05mm
Outer Layer Final Copper Thickness: 1OZ
Inner Layer Final Copper Thickness: 0.5OZ
Surface Finished: ENIG
Unit Size(mm): 142.58*140.75
Min. W/S(mil): 4.72/5.9
Min. Hole Size: 0.2mm
Solder Mask: Green+Yellow coverlay

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Are you a manufacturer (Factory) or trading company?
HoYoGo is a manufacturer with a mass production of 500000 sqm factory and a medium-size production for small-medium volume. Our UL No. is E493066.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com