HYG089R04311A

Product Image

Product Details

Special Request: Vias Plugged with Resin+Electroplate Flattened
Layer: 4L
Base Material: FR4
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 61.50*26.50
Min Hole Size: 0.25mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Do you have a price list?
PCB is customized product; all prices will depend on customer actual gerber data and qty request, it will be difficult to provide it.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com