HYG089R04349A

Product Image

Product Details

Special Request:
1. Outer Layer Final Copper Thickness: min. 25m
2. Plated Through Hole Copper Wall Thickness: Min. 13um
3. BGA

Layer: 4L
Base Material: FR4,CTI>175
Board Thickness: 0.8mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 75.00*43.00
Min W/S(mil): 2.5/3.15
Min Hole Size: 0.15mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Do you have a price list?
PCB is customized product; all prices will depend on customer actual gerber data and qty request, it will be difficult to provide it.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com