HYG089R04364A

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Product Details

Special Request:
1. 1-step HDI Blind & Buried Via PCB;
2. Impedance Control;
3. Laser-drilled blind vias need to be filled with
resin + copper capped plating of filled via holes;
Laser-drilled blind vias are located on the surface of
the SMT pads, PAD surface depression: Max. 20um.

Layer: 4L
Base Material: FR4 IT150GTC, PP IT-150GBS
Board Thickness: 0.5+/-0.1mm
Outer Layer Final Copper Thickness: 30um
Inner Layer Final Copper Thickness: 25um
Base Copper Thickness: 1/3OZ
Surface Finished: ENIG
Unit Size(mm): 28.63*30.40
Min. W/S(mil): 3.93/3.93
Min. Hole Size: 0.1mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s your most advantage of your supply?
@Standard mass production (>50sqm) from 1~8layer can be with very good price.
@ Mass production (>50sqm) of CEM-1, Alu material can be with very good price.
@ Special: we can produce long board up to 550x1500mm, thin board of min 0.15mm.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com