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HYG089R06318A

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HYG089R06318A

Product Details

Special Request:
1. Gold finger plating hard gold+Beveling
2. Beveling Depth: 0.5+/-0.2mm
3. Beveling Angle：45+/-5°

Layer: 6L
Base Material: FR4 TG170
Board Thickness: 1.6mm
Final Copper Thickness: 2OZ
Surface Finished: ENIG
Unit Size(mm): 305.94*205.80
Min Hole Size: 0.3mm

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FAQ

Can you produce board of gold finger?
Yes. HoYoGo can offer you gold finger, Au thickness can be suggested standard 30u” or per customer request.

Contact us

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.

(+86)-755-2300-1582

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