HYG089R06333A

Product Image

Product Details

Special Request:
PPAP Level3 supplied;
Designated position plug hole(Plug hole meets the IPC-4761 Type III-A standard);
Solder Mask Thickness: Line Angle: Min 4um,Line Surface: Min 10um.

Layer: 6L
Base Material: FR4,TG≧130,CTI>175
Board Thickness: 1.0mm
Final Copper Thickness: 1OZ
Surface Finished: HASL Lead Free
Unit Size(mm): 40.50*9.20
Min W/S(mil): 5.98/5
Min Hole Size: 0.2mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s your most advantage of your supply?
@Standard mass production (>50sqm) from 1~8layer can be with very good price.
@ Mass production (>50sqm) of CEM-1, Alu material can be with very good price.
@ Special: we can produce long board up to 550x1500mm, thin board of min 0.15mm.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com