HYG089R06352A
Product Image
Product Details
Special Request:
1. Solder Mask Thickness:
Solder Mask Thickness on Copper Edge: Min. 5um,
Solder Mask Thickness on Copper Surface: Min. 8um.
2. Impedance Control
Layer: 6L
Base Material: FR4 TG150 KB6165
Board Thickness: 1.6mm
Final Copper Thickness: 0.5/1OZ(inner/outer)
Surface Finished: ENIG
Unit Size(mm): 92.50*47.00
Min W/S(mil): 3.94/5.9
Min Hole Size: 0.2mm
Production Process
ISO Certification
UL Certification
Application areas
Who will be our parters
FAQ
-
What’s your quality standard? What’s certificates do you have?
-
Our production is strictly following high quality system of automotive products, we certified with ISO9001, ISO14001, ISO13485 and TS16949 and C-UL-S. All products strictly follow acceptance standard IPC-A-600-H and IPC-6012.
Contact us
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.