HYG089R12369A

Product Image

Product Details

Special Request:
1. Specify resin plugging and plating to fill 33
through-holes with a diameter of 0.25mm,
in compliance with IPC-4761 Type VII.
2. Impedance Control.

Layer: 12L
Base Material: FR4 TG≥150℃
Board Thickness: 2.0mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 443.80*70.00
Min. W/S(mil): 3.94/3.94
Min. Hole Size: 0.25mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Can you offer the third-party service, to make shipment direct to end customer but without documents (invoice)?
Yes, from our carrier partners, DHL, UPS, FEDEX, we have signed this service. And our forwarder by air or sea shipment can support this too.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com