HYG1027R02001A
Product Image
Product Details
Special Request:
Gold Finger:
Au: Min. 0.8um,
Ni: Min. 2.5um,
Beveling: 0.5+/-0.15mm.
Layer: 2L
Base Material: FR4 TG170
Board Thickness: 1.6mm
Final Copper Thickness: 2OZ
Surface Finished: ENIG
Unit Size(mm): 41.70*36.50
Min. Hole Size: 0.254mm Production Process
ISO Certification
UL Certification
Application areas
Who will be our parters
FAQ
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Can you provide some special material, like Rogers DuPont?
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Yes. We can offer Rogers material, the specific type shall to be confirmed.
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We can also offer Dupont material, we cooperate with Agent China.
Contact us
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.