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Products

HYG1027R02001A

Product Image
HYG1027R02001A
Product Details
Special Request: 
Gold Finger
Au: Min. 0.8um, 
Ni: Min. 2.5um, 
Beveling: 0.5+/-0.15mm.

Layer: 2L

Base Material: FR4 TG170
Board Thickness: 1.6mm
Final Copper Thickness: 2OZ
Surface Finished: ENIG
Unit Size(mm): 41.70*36.50
Min. Hole Size: 0.254mm
Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ
  • Can you provide some special material, like Rogers DuPont?
  • Yes. We can offer Rogers material, the specific type shall to be confirmed.
  • We can also offer Dupont material, we cooperate with Agent China.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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