HYG1146A01006A

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Product Details

Layer: 1L
Base Material: ALU 2KV/AC
Dielectric Layer Thickness: 0.1mm±20%
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: OSP
Unit Size(mm): 43.5*43.5
Panel Size(mm): 236.3*282.0
Solder Mask: White

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s your most advantage of your supply?
@Standard mass production (>50sqm) from 1~8layer can be with very good price.
@ Mass production (>50sqm) of CEM-1, Alu material can be with very good price.
@ Special: we can produce long board up to 550x1500mm, thin board of min 0.15mm.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com