HYG1147R04009A
Product Image
Product Details
Special Request:
1. Inner Beveling
2. Solder Mask Thickness: min 10um(Copper Surface)
Layer: 4L
Base Material: FR4 CTI>175
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 92.58*113.78
Min Hole Size: 0.3mm
Production Process
ISO Certification
UL Certification
Application areas
Who will be our parters
FAQ
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What’s your standard delivery time?
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Our standard delivery time will be 2weeks for 2L, 3weeks for multilayer according to production volume and customer request.
Contact us
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.