HYG1281F01013A
Product Image
Product Details
Layer: 1L
Base Material: PI
Board Thickness: 1.55mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 3.3*82.0
Solder Mask: Yellow Coverlay
FPC+Stiffener Thickness: 0.3±0.05mm
ISO Certification
UL Certification
Application areas
Who will be our parters
FAQ
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Is there UL certificate for your flexible board?
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YES. We can offer UL certificate of FPC.
Contact us
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.