HYG1281F02003D

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Product Details

Layer: 2L
Base Material: PI
Board Thickness: 0.22mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Panel Size(mm): 6.0*26.7
Min Hole Size: 0.15mm

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.