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Products

HYG1281F02025A

Product Image
HYG1281F02025A
Product Details
Special Request: 
1. Surface Finished: ENEPIG (Ni:120-240U", Pd: min 1.2U", Au: min 2U")
2. Top Layer: Yellow Solder Mask Ink;
    Bottom Layer: Yellow Coverlay

Layer: 2L
Base Material: PI
Board Thickness: 0.15mm
Final Copper Thickness: min25um
Surface Finished: ENEPIG
Unit Size(mm): 12.10*18.10
Min W/S(mil): 4.9/4.2
Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ
  • Is there UL certificate for your flexible board?
  • YES. We can offer UL certificate of FPC.

Contact us

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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