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HYG1313R04002A

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HYG1313R04002A

Product Details

Layer: 4L
Base Material: FR4
Board Thickness: 1.64mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 152.4*142.24
Panel Size(mm): 304.8*284.48
Min W/S(mil): 6/5
Min Hole Size: 0.2mm
Solder Mask Thickness: 10um(min)
PTH Tolerance for Diameter 0.2mm: + 0.075/-0.2mm

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UL Certification

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FAQ

Can you produce board of gold finger?
Yes. HoYoGo can offer you gold finger, Au thickness can be suggested standard 30u” or per customer request.

Contact us

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.

(+86)-755-2300-1582

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