HYG1316R04001A
Product Image
Product Details
Layer: 4L
Base Material: FR4 TG170
Board Thickness: 0.8mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 22.0*18.0
Panel Size(mm): 138.0*98.0
Min W/S(mil): 4.7/5
Min Hole Size: 0.2mm
Special Request: Half Hole; BGA;
Vias Plugged with Resin; Electroplate Flattened
ISO Certification
UL Certification
Application areas
Who will be our parters
FAQ
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What’s your main material type?
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KB, SY, NY, ITEQ, TUC, Ventec, etc.
Contact us
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.