HYG1509R04018A

Product Image

Product Details

Special Request:
1. Ball pad;
2. Laser barcode;
3. Holes＞0.2mm need to be plugged with resin+filling.

Layer: 4L
Base Material: FR4 TG150
Board Thickness: 0.9+/—0.1mm
Outer Layer Final Copper Thickness: 1OZ
Inner Layer Final Copper Thickness: 0.5OZ
Surface Finished: ENIG
Unit Size(mm): 65.32*41.77
Min. W/S(mil): 3/4
Min. Hole Size: 0.2mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

If your lead time for small volume can be 3-5wds?
YES. HoYoGo can offer quick-turn service, we can produce single-sided and double sided within 3~5wds.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com