HYG1768R02115A

Product Image

Product Details

Special Request:
Plug via with solder mask
Solder Mask: Light Green(H-9100-32G)

Layer: 2L
Base Material: FR4 TG140(SY)
Board Thickness: 1.6mm
Final Copper Thickness: 35um
Surface Finished: OSP
Unit Size(mm): 181.00*111.0
Min W/S(mil): 7.87/7.9

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Can you update a WIP to us every day?
Yes, no problem. We can update it to you every day or every couple of days depends on customer request.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com