HYG1804R06002B

Product Image

Product Details

Layer: 6L
Base Material: FR4 IT-158
Board Thickness: 1.574mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 29.0*197.0
Panel Size(mm): 136.0*197.0
Min W/S(mil): 6/6
Solder Mask: Blue

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Can you offer FOB HK?
We have truck to HONGKONG every day. It will request MOV per shipment due to the local charge. Or we can shift with FOB and FCA according to order value.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com