HYG1804R06003B

Product Image

Product Details

Layer: 6L
Base Material: FR4 IT-158
Board Thickness: 1.574mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 29.0*197.0
Panel Size(mm): 136.0*197.0
Min W/S(mil): 6/6
Solder Mask : Blue

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

If your lead time for small volume can be 3-5wds?
YES. HoYoGo can offer quick-turn service, we can produce single-sided and double sided within 3~5wds.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com