HYG306R06006B

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Product Details

Special Request: Au: 0.03um(Min); Ni: 3-6um.
Layer: 6L
Base Material: FR4 TG135
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 30.00*56.00
Min W/S(mil): 7.9/4
Min Hole Size: 0.2mm

Production Process

ISO Certification

UL Certification

Application areas

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FAQ

Can you update a WIP to us every day?
Yes, no problem. We can update it to you every day or every couple of days depends on customer request.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com