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HYG500RF02004A

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HYG500RF02004A

Product Details

Rigid-flex PCB
Layer: 2L
Base Material: FR4(TG150℃)+FPC
Board Thickness: Rigid Area: 1.0±0.1mm;
Flex Area: 0.15±0.03mm
Final Copper Thickness: ≥35UM
Surface Finished: ENIG
Unit Size(mm): 64.14*184.84
Min. W/S(mil): 7.8/7.8
Min. Hole Size: 0.2mm
Solder Mask: Green+Yellow coverlay

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Can you update a WIP to us every day?
Yes, no problem. We can update it to you every day or every couple of days depends on customer request.

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.

(+86)-755-2300-1582

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