HYG502R04031A

Product Image

Product Details

Special Request:
1. Solder Mask Model: H-9100 8G,
Solder Mask Thickness≥10um;
2. Bow & Twist≤0.7%.

Layer: 4L
Base Material: FR4 (KB6160)
Board Thickness: 1.6mm
Outer Layer Final Copper Thickness: 35UM
Inner Layer Final Copper Thickness: 1OZ
Surface Finished: HASL Lead Free
Unit Size(mm): 106.00*113.00
Min. W/S(mil): 5.98/6.96
Min. Hole Size: 0.2mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s your most advantage of your supply?
@Standard mass production (>50sqm) from 1~8layer can be with very good price.
@ Mass production (>50sqm) of CEM-1, Alu material can be with very good price.
@ Special: we can produce long board up to 550x1500mm, thin board of min 0.15mm.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com