HYG502R04032A

Product Image

Product Details

Special Request:
1. Solder Mask Thickness on Copper Surface≥10um,
Solder Mask Thickness on Copper Edge≥5um;
2. BOM&Twist≤0.7%;
3. Vias Plugged with Resin+Copper Cap Plating of Filled Holes;
4. Metallised half slot, Press fit hole.

Layer: 4L
Base Material: FR4 TG180
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 20.00*79.40
Min. W/S(mil): 10/7.87

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s kind of PCB can you produce?
Our production is producing rigid PCB from 2~56layer with small- medium- mass volume. In the meantime, we can offer you FPC, Rigid-flex, HDI, all other special PCBs from our partner production.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com