HYG502R04050A

Product Image

Product Details

Special Request:
1. Vias Plugged with Resin+Copper Cap Plating of Filled Holes;
2. Metallised half slot, Half hole, Press fit hole.

Layer: 4L
Base Material: FR4 TG180℃
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 20.02*79.40
Min. W/S(mil): 10/5.97
Min. Hole Size: 0.25mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s your standard delivery time?
Our standard delivery time will be 2weeks for 2L, 3weeks for multilayer according to production volume and customer request.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com