HYG502R06045A

Product Image

Product Details

Layer: 6L
Base Material: FR4
Board Thickness: 1.0mm
Outer Layer Final Copper Thickness: 35UM
Inner Layer Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 70.00*35.00
Min. W/S(mil):7.87 /3.13

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Do you offer DDP service in your company?
Yes, if necessary, we can offer you this service.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com