HYG504RF02004A

Product Image

Product Details

Rigid-flex PCB
Layer: 2L
Base Material: FR4(TG150℃)+FPC
Board Thickness: Rigid Area: 0.8±0.1mm;
Flex Area: 0.21±0.05mm
Final Copper Thickness: ≥35UM
Surface Finished: ENIG
Unit Size(mm): 79.05*82.07
Min. W/S(mil): 5.91/4.92
Min. Hole Size: 0.152mm
Solder Mask: Green+Yellow coverlay

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Are you a manufacturer (Factory) or trading company?
HoYoGo is a manufacturer with a mass production of 500000 sqm factory and a medium-size production for small-medium volume. Our UL No. is E493066.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com