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Products

HYG504RF02006A

Product Image
HYG504RF02006A
Product Details
Rigid-flex PCB
Special Request: 

Double sided FPC+FR4 stiffener on bottom side+PI stiffener on top side(Back of finger)

Layer: 2L

Base Material: FPC(PI 50um)+FR4 Stiffener(TG150℃)+PI Stiffener
Board Thickness: FPC+FR4 Stiffener: 1.6±0.16mm;
                             Pure FPC Area: 0.15±0.03mm; 
                             FPC+PI Stiffener: 0.3±0.03mm
Final Copper Thickness: ≥28UM
Surface Finished: ENIG
Unit Size(mm): 63.80*194.10
Solder Mask: Yellow coverlay
Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ
  • What kind of board can you offer? How about the layer count and base material?
  • HoYoGo can offer board of HDI, gold finger, hard gold, flexible, rigid-flex, metal base, quick-turn around and PCBA. The layer is normally from 1 to 28layer. The base material also depends on the requirement, it can be KB or shengyi, etc.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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