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HYG511F02006A

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HYG511F02006A

Product Details

Gold Finger FPC
Special Request:
Each unit has 2 pieces stiffener with PI material,
T=0.3+/-0.03mm.

Layer: 2L
Base Material: PI 25um
Board Thickness: 0.3mm
Final Copper Thickness: 18um
Surface Finished: ENIG
Unit Size(mm): 20.50*150.00
Min W/S(mil): 3.93/5.5
Min Hole Size: 0.15mm
Solder Mask: Yellow coverlay

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ISO Certification

UL Certification

Application areas

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FAQ

Can you produce board of gold finger?
Yes. HoYoGo can offer you gold finger, Au thickness can be suggested standard 30u” or per customer request.

Contact us

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.

(+86)-755-2300-1582

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