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HYG511F02009A

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HYG511F02009A

Product Details

Gold Finger FPC
Special Request:
2 Stiffiners on the top side per unit,
Total Board Thickness of Finger Area: 0.30±0.03mm

Layer: 2L
Base Material: FPC PI 25um
Board Thickness: 0.30mm±0.03mm(FPC+PI stiffiner)
Final Copper Thickness: 18UM
Surface Finished: ENIG
Unit Size(mm): 12.36*50.00
Min. W/S(mil): 4.7/4.37
Min. Hole Size: 0.15mm
Solder Mask: Yellow coverlay

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Can you update a WIP to us every day?
Yes, no problem. We can update it to you every day or every couple of days depends on customer request.

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.

(+86)-755-2300-1582

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